Verification and Validation
This week I spent working on Robotic Arm (RA) Verification and Validation (VandV). Each instrument must meet certain requirements and each must be tested. This batch of tests involved showing the RA is capable of moving the Thermal and Electric Conductivity Probe (TECP), located at the end of the arm, in a smooth, straight line. This is to meet the requirement on precision in insertion and extraction of the probe into the ground, without damaging the probe leads. You can view a picture of the TECP, and the other instruments, on the Phoenix website.
The test involved moving the RA into four separate positions, close to the lander deck, high and low, and outstretched, high and low. We then set up a video camera and a plane background and recorded the motion as the RA was directed to move 10 or 20 centimeters. The video will be reviewed by JPL to determine if the motion is smooth enough.
Posted
at 04:13 PM
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